By planet 3Ed now! According to a series of screenshots shared by the website, the next generation amd Xiaolong (epyc) processor will be divided into two categories The first is Genoa with a maximum of 96c / 192T, followed by Bergamo product line with a maximum of 128C / 256t The multi chip (MCM) image of the former has been exposed. There are 12 CCD modules based on 5nm process @ Zen 4 architecture on the display substrate, supplemented by a new generation of SIOD (or based on 6nm process).
(Figure via planet3dnow. De)
Given that Genoa's CPU substrate seems to be packed with 12 small chips, it not only makes us doubt whether AMD is ready to provide Bergamo with a larger package.
However, in the latest enterprise demonstration, amd reiterated that Bergamo will use the same SP5 (lga-6096) package as Genoa.
Both Zen 4 and Zen 4C adopt TSMC N5 process (5nm EUV)
But then we have two guesses - either the company is trying to make room for more CCDs, or the size of each CCD will become larger.
Amd claims that the compute intensive Bergamo CCD will be based on the Zen 4C microarchitecture
At present, there are still few details about Zen 4C. We only know that it is the "cloud optimized" version of Zen 4 architecture - perhaps its power characteristics will be more suitable for high-density cloud computing environment on the basis of retaining the complete instruction set architecture of Zen 4.