Juheng reported today that according to Korean media, Samsung Electronics has replaced the head of the semiconductor R & D center responsible for developing the next generation of chips, and the senior management of the wafer foundry business has also been reshuffled, with storage experts leading the core Department of the wafer foundry business. According to the analysis of the industry, at the time when it is about to take the lead in mass production of 3nm, it has been repeatedly said that Samsung's poor yield of advanced processes is the biggest problem. This drastic high-level reshuffle is to accelerate the improvement of yield of advanced processes and compete with TSMC.
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It is reported that Samsung Electronics has appointed song Jae Hyuk, vice president and head of flash development department, as the new head of Semiconductor R & D center. In terms of foundry business, Nam Seok woo, vice president of global manufacturing and infrastructure of semiconductor equipment solutions, was appointed as the head of the foundry manufacturing technology center. It is reported that both of them are experts in Samsung storage process technology development. Samsung also appointed Kim Hong Shik, vice president of the memory manufacturing technology center, to lead the foundry technology innovation team.
It is reported that Samsung expects to mass produce the 3nm process as soon as this (June), and overtake TSMC plans to mass produce the 3nm process in the second half of the year.
(checked by /sharon)