TSMC has the advantages of advanced process technology and professional wafer foundry. Its leading position in the industry is still hard to shake, while the pursuers Samsung and Intel are eyeing it. Today, juheng.com wrote an article and pointed out that in addition to continuously expanding production and sprinting advanced process technology, Samsung and Intel are also actively catching up with TSMC through various strategies such as mergers and acquisitions, cooperation with competitors and equipment grabbing.
Samsung has made frequent moves recently. In late May, it announced that its capital expenditure in the next five years would reach 360billion US dollars, targeting semiconductor, biomedical and communication fields. Although it did not disclose details such as the proportion of capital expenditure investment in various undertakings, Samsung will focus on investing in the semiconductor field. It is preliminarily estimated that the scale of semi conductor investment in the next five years will exceed 100 billion US dollars.
In addition to large-scale investment, in order to compete for EUV equipment, it is reported that Lee Jae Yong, vice president of SamSung group, will go to the Netherlands next week to visit ASML, a large semiconductor equipment manufacturer, with the goal of obtaining the most advanced lithography machine.
In addition, Samsung announced the establishment of a special working group in April, which is directly managed by Han Jong hee, vice president. The members of the group include about 10 senior executives and employees of the planning and Strategy Department and each department, so as to speed up the merger and acquisition action; When Li Zairong went to the Netherlands this time, it is also expected that Li Zairong will explore M & A opportunities to accelerate the growth of the semiconductor industry.
According to the juheng.com report, Intel is also active, reflecting the shopping strategy of "the enemy of the enemy is a friend". CEO Kissinger went to South Korea last week to meet with Lee Jae Yong. The two sides will cooperate in the next generation of memory chips, system chips, wafer foundry, PCs and mobile terminals.
Industry analysts pointed out that Intel intends to diversify the risk of relying on TSMC by strengthening cooperation with Samsung, and seek more support from Samsung for foundry capacity. (check / promise)