Hot Chips Preview: Intel Will Show Foveros 3D Encapsulated Meteor / Arrow Lake Chip

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While everyone generally focused on Computex 2022 Taipei Computer Exhibition, Tom's hardware also predicted that Intel would display the weather / arrow Lake chip encapsulated in foveros 3D at the hot chips 34 conference in August** According to the plan, the major event of the semiconductor industry is scheduled to be held from August 21 to 23 (Sunday to Tuesday). At that time, representatives from Intel, AMD, NVIDIA, Tesla and other technology giants will attend.

Jingdong's main venue on June 18, 2022 - pre order on the evening of May 23

With Intel completing the activity registration, we finally know that the company will show its work progress on the meteor lake and arrow Lake processors, such as adopting the new foveros 3D packaging process and client platform.

In addition, during the full virtual exhibition, the company will also discuss the architecture, system and software solutions related to Ponte Vecchio GPU, as well as some Xeon D and FPGA demonstrations.

Interested friends can move to hot chips official website For details. Finally, if all goes well, meteor lake will take over the upcoming Raptor Lake design and officially release it next year.

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