Techpowerup reported that: amd's upcoming Zen 4 desktop CPU seems to have entered the hands of an overclocking player in advance As shown in the figure below, the spy photo shows the internal structure of the Am5 CPU heat dissipation top cover (IHS), indicating that it integrates an IOD and two groups of Zen 4 CCD on the substrate.
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Compared with the CPU top cover seen before, the Am5 IHS is much thicker. However, in view of the overclocking player's "cover opening" experience, it seems not difficult to see several small chips brazed.
In addition techpowerup It is pointed out that, different from the CPU with firm sealing design currently adopted, the Zen 4 desktop processor seems to be "skimming the water" on only a few chip bits.
Generally, chip manufacturers will coat some interface materials on IHS to improve the welding effect.
It is not known whether the chip body was damaged or whether the brazing material was left on the top cover of the CPU.