In the latest issue of tubing video, adored TV shared the roadmap information related to AMD's next-generation server chip The disclosure not only covered the epyc CPU of Genoa, Bergamo, genoa-x and Turin architecture, but also mentioned the new SP6 platform Although it is temporarily impossible to verify the authenticity of this group of presentations, it is not the first time we have heard relevant revelations.
（via WCCFTech）
The first is the roadmap of epyc server CPU + supporting motherboard platform from 2021 to 2023. For example, epyc 7003x "milan-x" recently launched by AMD has put a successful end to SP3 platform through Zen 3 kernel + 3D v-cache.
Next, AMD will focus on the SP5 platform based on LGA 6096 socket, supplemented by at least two generations of processor lineups - Genoa and Bergamo.
The former has up to 96 Zen 4 cores / 200-400W SKUs, while the latter has up to 128 Zen 4 cores / 320-400w SKUs.
As a high-end platform, SP5 also has the option of single / dual server, supporting 12 channel ddr5 memory, up to 160 PCIe 5.0 and 64 CXL v1.0 1 + channel and 12 PCIe 3.0.
Like the video shared by Moore's law is dead the day before yesterday, adored TV also mentioned genoa-x in its shared roadmap. It is expected that this series of Xiaolong CPUs will be produced at the end of the first to third quarters of 2023 and will be launched around the middle of 2023.
They adopt a design method similar to the milan-x chip of 3D v-cache, and the super large L3 cache will be a highlight of this series of SKUs. In general, the SP5 platform is expected to eventually be compatible with three series epyc CPUs.
As for SP6, it is said that it is only a cost optimized version of SP6 for edge servers - providing one-way solution, 6-channel memory, 96 PCIe 5.0 + 48 CXL v1 1 + channel and 8 PCIe 3.0.
It is expected that SP6 will use Zen 4 Xiaolong processor, but it is limited to entry-level SKU options - up to 32 core Zen 4 / 64 core Zen 4C, and the thermal design power consumption (TDP) is between 70-225w.
In addition, SP6 is expected to support the entry-level derivative models of Genoa, Bergamo and even Turin series, focusing on the edge / telecommunications and other fields with optimized computing density and characteristics per watt.
In addition, in the leaked document found by @ olrak, it can be seen that the SP6 slot looks very similar to SP3 (58.5 × 75.4), so we speculate that it is similar to the packaging layout of the existing epyc CPU.
However, this series of chips may not have the completed 12 groups of small chips like Bergamo, but follow the mature 8 groups of small chips scheme. At the same time, the internal pin layout is also changed from LGA 4096 (SP3) to LGA 4844.
Adored is back with some new AMD leaks（via）
Finally, most of these products are expected to arrive from the second half of 2022 to the first half of 2024. With the approach of Computex 2022 in late May, AMD is also expected to officially announce a new road map soon.